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Gold Finger Multilayer PCB Rigid Printed Circuit Board For Graphics Card Slot

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Shenzhen Tecircuit Electronics Limited

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Gold Finger Multilayer PCB Rigid Printed Circuit Board For Graphics Card Slot

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Brand Name :	TECircuit
Model Number :	TEC0194
Certification :	UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Price :	USD 1.99 ~ USD9.99/pcs
Payment Terms :	L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :	50000 pcs/month
Delivery Time :	5-15 wotk days

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Product Details
Company Profile

Gold Finger Multilayer PCB Rigid Printed Circuit Board For Graphics Card Slot

Product Images

About TECircuit

Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2

Product Applications

Graphics Card Interfaces:
- Used to connect graphics cards to the motherboard, facilitating high-speed data transfer between the GPU and other system components.
PCI Express (PCIe) Connectors:
- Integrated into RFPCBs that support PCIe slots, allowing for enhanced graphics performance and compatibility with modern GPUs.
Power Distribution:
- Employed in circuits that distribute power to the graphics card, ensuring stable operation and performance under load.
Cooling Systems:
- Used in designs that integrate cooling solutions (like fans or heat sinks) with the graphics card, ensuring effective thermal management.
Video Output Interfaces:
- Integrated into PCBs that connect to various video output ports (HDMI, DisplayPort, DVI), facilitating connections to monitors and displays.
Multi-GPU Configurations:
- Employed in systems that support multiple graphics cards (SLI or CrossFire), enabling scalability in graphics performance.
Embedded Graphics Solutions:
- Used in compact devices that require integrated graphics capabilities, such as gaming laptops and compact desktops.
High-Performance Computing (HPC):
- Integrated into systems designed for high-performance tasks, such as scientific computations and 3D rendering, where graphics processing is critical.
Gaming Consoles:
- Used in the internal architecture of gaming consoles, connecting the graphics processing unit to other critical components.
Augmented and Virtual Reality (AR/VR):
- Employed in systems designed for AR/VR applications, where high graphics performance and low latency are essential for user experience.

Product Features

Flexibility:
- RFPCBs can be designed to fit complex layouts within compact spaces, optimizing the internal design of computers and devices.
Space Efficiency:
- The rigid-flex design allows for reduced size and weight, which is beneficial in high-density electronic environments.
High Signal Integrity:
- Designed to minimize signal loss and interference, ensuring reliable high-speed data transmission between the graphics card and motherboard.
Durability:
- Built to withstand mechanical stress and thermal cycles, ensuring long-lasting performance in high-demand environments.
Thermal Management:
- Effective heat dissipation features help maintain optimal temperatures for the graphics card, enhancing performance and reliability.
Customizability:
- Can be tailored to meet specific design and performance requirements, allowing for unique configurations based on the application.
Ease of Assembly:
- Simplifies the manufacturing and assembly process, enabling efficient integration into computer systems.
Lightweight:
- The lightweight nature of RFPCBs contributes to overall system efficiency, particularly in portable devices.
Resistance to Environmental Factors:
- Often treated to resist moisture, dust, and other contaminants, enhancing reliability in various operating conditions.
Compliance with Industry Standards:
- Manufactured to meet relevant safety and performance standards, ensuring dependable operation in critical graphics applications.

FAQ

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

Product Description

Specification:
PCB layers:	1-42layers
PCB materials:	CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:	620mm*1100mm
PCB certificate:	RoHS Directive-Compliant
PCB Thickness:	1.6 ±0.1mm
Out Layer Copper Thickness:	0.5-5oz
Inner Layer Copper Thickness:	0.5-4oz
PCB max. board thickness:	6.0mm
Minimum Hole Size:	0.20mm
Minimum Line Width/Space:	3/3mil
Min. S/M Pitch:	0.1mm(4mil)
Plate Thickness and Aperture Ratio :	30:1
Minimum Hole Copper:	20µm
Hole Dia. Tolerance(PTH):	±0.075mm(3mil)
Hole dia. Tolerance(NPTH):	±0.05mm (2mil)
Hole Position Deviation:	±0.05mm (2mil)
Outline Tolerance:	±0.05mm (2mil)
PCB solder mask:	Black, white, yellow
PCB surface finished:	HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend:	White
E-test:	100% AOI, X-ray, Flying probe test.
Outline:	Rout and Score/V-cut
Inspection Standard:	IPC-A-610CCLASSII
Certificates:	UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:	Final Inspection, E-test, Solderability Test, Micro Section and More

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