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Multilayer Rigid FPC Circuit Boards For Audio Equipment OEM PCB Manufacturer

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Shenzhen Tecircuit Electronics Limited

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Multilayer Rigid FPC Circuit Boards For Audio Equipment OEM PCB Manufacturer

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Brand Name :	TECircuit
Model Number :	TEC0175
Certification :	UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Price :	USD 1.99 ~ USD9.99/pcs
Payment Terms :	L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :	50000 pcs/month
Delivery Time :	5-15 wotk days

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Product Details
Company Profile

Multilayer Rigid FPC Circuit Boards For Audio Equipment OEM PCB Manufacturer

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About TECircuit

Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2

Product Applications

Signal Processing Boards:
- Used in audio signal processing equipment to connect various components, ensuring high-quality sound reproduction.
Amplifiers:
- Integrated into amplifier circuits, facilitating connections between input, output, and power supply components for optimal performance.
Digital Signal Processors (DSPs):
- Employed in DSP modules to process audio signals, enhancing sound quality and enabling effects like equalization and filtering.
Microphone Connections:
- Used to connect microphones to audio interfaces or mixers, ensuring clear audio capture with minimal interference.
Wireless Audio Transmitters:
- Integrated into wireless audio transmission systems, connecting RF components for seamless audio streaming.
Headphone and Earphone Circuits:
- Employed in headphone and earphone designs, connecting drivers and microphones for high-quality audio output.
Mixing Consoles:
- Used in professional audio mixing consoles, facilitating connections between multiple audio channels for live sound or studio recording.
Home Theater Systems:
- Integrated into home theater equipment, connecting various audio sources and outputs for immersive sound experiences.
Bluetooth Audio Devices:
- Employed in Bluetooth-enabled audio devices, connecting RF components for wireless audio streaming.
Sound Effects Units:
- Used in devices that generate sound effects, connecting various audio manipulation circuits for creative sound design.

Product Features

Flexibility:
- The combination of rigid and flexible regions allows for complex shapes and designs, accommodating compact audio equipment layouts.
Space Efficiency:
- RFPCBs save space in audio equipment, enabling more compact designs without sacrificing functionality.
High Signal Integrity:
- Designed to minimize signal loss and interference, ensuring high-quality audio performance across all frequency ranges.
Durability:
- Built to withstand the rigors of regular use, including vibrations and environmental factors, enhancing reliability over time.
Thermal Management:
- Effective heat dissipation properties help maintain optimal operating temperatures for sensitive audio components.
Customizability:
- Can be tailored to specific audio equipment requirements, allowing for unique configurations and integration of various components.
Ease of Assembly:
- Simplifies the manufacturing and assembly process, reducing production time and costs for audio devices.
Lightweight:
- The lightweight nature of RFPCBs contributes to the overall portability of audio equipment, making it easier to transport.
Resistance to Environmental Factors:
- Often treated to resist moisture, dust, and chemicals, making them suitable for a variety of audio applications.
Compliance with Industry Standards:
- Manufactured to meet relevant safety and performance standards in the audio industry, ensuring dependable operation.

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

Product Description

Specification:
PCB layers:	1-42layers
PCB materials:	CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:	620mm*1100mm
PCB certificate:	RoHS Directive-Compliant
PCB Thickness:	1.6 ±0.1mm
Out Layer Copper Thickness:	0.5-5oz
Inner Layer Copper Thickness:	0.5-4oz
PCB max. board thickness:	6.0mm
Minimum Hole Size:	0.20mm
Minimum Line Width/Space:	3/3mil
Min. S/M Pitch:	0.1mm(4mil)
Plate Thickness and Aperture Ratio :	30:1
Minimum Hole Copper:	20µm
Hole Dia. Tolerance(PTH):	±0.075mm(3mil)
Hole dia. Tolerance(NPTH):	±0.05mm (2mil)
Hole Position Deviation:	±0.05mm (2mil)
Outline Tolerance:	±0.05mm (2mil)
PCB solder mask:	Black, white, yellow
PCB surface finished:	HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend:	White
E-test:	100% AOI, X-ray, Flying probe test.
Outline:	Rout and Score/V-cut
Inspection Standard:	IPC-A-610CCLASSII
Certificates:	UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:	Final Inspection, E-test, Solderability Test, Micro Section and More

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