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Metal Core PCB MC PCB Rigid PCB Printed Circuit Board for Bluetooth Headset

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Shenzhen Tecircuit Electronics Limited

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Metal Core PCB MC PCB Rigid PCB Printed Circuit Board for Bluetooth Headset

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Brand Name :	TECircuit
Model Number :	TEC0123
Certification :	UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Price :	USD 1.99 ~ USD9.99/pcs
Payment Terms :	L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :	50000 pcs/month
Delivery Time :	5-15 wotk days

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Product Details
Company Profile

Metal Core PCB MC PCB Rigid PCB Printed Circuit Board for Bluetooth Headset

Product Images

About TECircuit

Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2

Product Applications

Wireless Audio Streaming:
- Used in Bluetooth headsets for streaming audio from smartphones, tablets, and computers without wired connections.
Hands-Free Calling:
- Integrated into headsets that allow users to make and receive calls wirelessly, enhancing convenience and safety while driving.
Gaming:
- Employed in gaming headsets that support low-latency audio, providing an immersive gaming experience with wireless freedom.
Voice Assistants:
- Used in headsets that support voice commands for virtual assistants like Siri, Google Assistant, or Alexa.
Fitness and Sports:
- Integrated into sports-oriented Bluetooth headsets that provide audio feedback for workouts, designed to withstand sweat and environmental exposure.
Teleconferencing:
- Used in headsets designed for business communication, providing high-quality audio for virtual meetings and calls.
Noise Cancellation:
- Employed in active noise-canceling (ANC) headsets, utilizing advanced circuitry to reduce ambient noise for better listening experiences.
Audio Monitoring:
- Used in professional audio equipment for monitoring sound quality during recordings or live performances.
Assistive Listening Devices:
- Integrated into devices that help users with hearing impairments by amplifying sounds wirelessly from various audio sources.
Smart Wearables:
- Used in smart glasses or other wearable tech that incorporates audio functionality for hands-free communication and audio playback.

Product Features

Compact Design:
- Designed to be small and lightweight, enabling integration into the limited space of Bluetooth headsets.
Low Power Consumption:
- Features energy-efficient components to maximize battery life, allowing for longer use between charges.
Bluetooth Connectivity:
- Supports various Bluetooth profiles (e.g., A2DP, HFP, HSP) for seamless audio streaming and call functionality.
Integrated Microphone:
- Often includes built-in microphones for clear voice transmission during calls and voice commands.
Audio Processing:
- Incorporates digital signal processing (DSP) for improved sound quality, including equalization and noise reduction features.
User Controls:
- May include buttons or touch-sensitive controls for play/pause, volume adjustment, and call management.
Durability:
- Built to withstand daily use, often featuring sweat and water resistance for sports and outdoor activities.
Firmware Updatability:
- Capable of receiving firmware updates to enhance performance, improve compatibility, and add new features.
Charging Solutions:
- Designed for easy charging, often utilizing USB-C or wireless charging capabilities for user convenience.
Compliance with Wireless Standards:
- Meets industry standards for wireless communication (e.g., Bluetooth SIG specifications), ensuring reliable performance and interoperability with other devices.

FAQ

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

Product Description

Specification:
PCB layers:	1-42layers
PCB materials:	CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:	620mm*1100mm
PCB certificate:	RoHS Directive-Compliant
PCB Thickness:	1.6 ±0.1mm
Out Layer Copper Thickness:	0.5-5oz
Inner Layer Copper Thickness:	0.5-4oz
PCB max. board thickness:	6.0mm
Minimum Hole Size:	0.20mm
Minimum Line Width/Space:	3/3mil
Min. S/M Pitch:	0.1mm(4mil)
Plate Thickness and Aperture Ratio :	30:1
Minimum Hole Copper:	20µm
Hole Dia. Tolerance(PTH):	±0.075mm(3mil)
Hole dia. Tolerance(NPTH):	±0.05mm (2mil)
Hole Position Deviation:	±0.05mm (2mil)
Outline Tolerance:	±0.05mm (2mil)
PCB solder mask:	Black, white, yellow
PCB surface finished:	HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend:	White
E-test:	100% AOI, X-ray, Flying probe test.
Outline:	Rout and Score/V-cut
Inspection Standard:	IPC-A-610CCLASSII
Certificates:	UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:	Final Inspection, E-test, Solderability Test, Micro Section and More

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