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High Circuit Density FPC Flexible PCB Printed Circuit Board For Smartphone

Shenzhen Tecircuit Electronics Limited
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    Buy cheap High Circuit Density FPC Flexible PCB Printed Circuit Board For Smartphone from wholesalers
     
    Buy cheap High Circuit Density FPC Flexible PCB Printed Circuit Board For Smartphone from wholesalers
    • Buy cheap High Circuit Density FPC Flexible PCB Printed Circuit Board For Smartphone from wholesalers

    High Circuit Density FPC Flexible PCB Printed Circuit Board For Smartphone

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    Brand Name : TECircuit
    Model Number : TEC0168
    Certification : UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
    Price : USD 1.99 ~ USD9.99/pcs
    Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
    Supply Ability : 50000 pcs/month
    Delivery Time : 5-15 wotk days
    • Product Details
    • Company Profile

    High Circuit Density FPC Flexible PCB Printed Circuit Board For Smartphone

    Product Images

    High Circuit Density FPC Flexible PCB Printed Circuit Board For Smartphone


    About TECircuit


    Found: TECircuit has been operating since 2004.

    Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.


    Item: Customizable EMS PCB, offers a full range of one-stop
    shop services.

    Service:
    Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing,
    Box-Building, Testing.


    Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

    Factory Pictures:
    Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2


    Product Applications


    • Display Connections:

      • Used to connect screens (LCD, OLED) to the motherboard, facilitating flexible routing in compact spaces.
    • Camera Modules:

      • Employed to connect front and rear cameras to the main circuit board, allowing for high-resolution image capture.
    • Battery Connections:

      • Integrated into circuits that connect batteries to power management systems, enabling efficient power distribution.
    • Touchscreen Interfaces:

      • Used in touchscreen assembly to connect touch sensors, ensuring responsive interaction with the device.
    • Audio Components:

      • Employed to connect microphones, speakers, and audio chips, supporting high-quality sound output and input.
    • Wireless Communication Modules:

      • Integrated into modules for Wi-Fi, Bluetooth, and cellular communication, ensuring reliable connectivity.
    • Sensors:

      • Used to connect various sensors (accelerometers, gyroscopes, proximity sensors) that enhance smartphone functionality.
    • LED Notifications:

      • Employed in circuits for notification lights or indicators to provide visual alerts for incoming messages or calls.
    • Charging Ports:

      • Integrated into charging circuits, facilitating connections for USB or wireless charging systems.
    • Vibration Motors:

      • Used to connect haptic feedback motors, enhancing user experience through tactile notifications.

    Product Features

    1. Flexibility:

      • FPCs can bend and conform to the intricate shapes of smartphone designs, optimizing space utilization.
    2. Lightweight:

      • The lightweight nature of FPCs contributes to the overall reduction in device weight, enhancing portability.
    3. Thin Profile:

      • FPCs are thinner than traditional rigid PCBs, allowing for sleeker device designs without compromising functionality.
    4. High Thermal Resistance:

      • Designed to withstand heat generated by components, ensuring reliable performance during prolonged use.
    5. Excellent Electrical Performance:

      • Provides low resistance and high signal integrity, essential for the fast data transmission required in smartphones.
    6. Durability:

      • Built to endure mechanical stress and vibrations, ensuring long-term reliability in everyday use.
    7. Customization:

      • Can be tailored to fit specific smartphone designs and configurations, allowing for unique layouts.
    8. Ease of Assembly:

      • Simplifies the manufacturing process, making it easier to integrate into compact smartphone designs.
    9. Water and Dust Resistance:

      • Often treated with protective coatings to withstand environmental factors, enhancing durability.
    10. Compliance with Industry Standards:

      • Manufactured to meet industry safety and performance standards, ensuring reliable operation in consumer electronics.

    Question 1: What is needed for a quotation?
    Answer:
    PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
    PCBA: PCB information, BOM,(Testing documents...)

    Q2: What file formats do you accept for production?
    Answer:
    PCB Gerber file
    BOM list for PCB
    Test method for PCBA


    Q3: Are my files safe?
    Answer:
    Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

    Q4: What is the shipment method?
    Answer:

    We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

    Q5: What is the payment method?
    Answer:
    Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

    Product Description

    Specification:
    PCB layers:1-42layers
    PCB materials:CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
    PCB max. board size:620mm*1100mm
    PCB certificate:RoHS Directive-Compliant
    PCB Thickness:1.6 ±0.1mm
    Out Layer Copper Thickness:0.5-5oz
    Inner Layer Copper Thickness:0.5-4oz
    PCB max. board thickness:6.0mm
    Minimum Hole Size:0.20mm
    Minimum Line Width/Space:3/3mil
    Min. S/M Pitch:0.1mm(4mil)
    Plate Thickness and Aperture Ratio :30:1
    Minimum Hole Copper:20µm
    Hole Dia. Tolerance(PTH):±0.075mm(3mil)
    Hole dia. Tolerance(NPTH):±0.05mm (2mil)
    Hole Position Deviation:±0.05mm (2mil)
    Outline Tolerance:±0.05mm (2mil)
    PCB solder mask:Black, white, yellow
    PCB surface finished:HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
    Legend:White
    E-test:100% AOI, X-ray, Flying probe test.
    Outline:Rout and Score/V-cut
    Inspection Standard:IPC-A-610CCLASSII
    Certificates:UL (E503048),ISO9001/ISO14001/IATF16949
    Outgoing Reports:Final Inspection, E-test, Solderability Test, Micro Section and More
    Quality High Circuit Density FPC Flexible PCB Printed Circuit Board For Smartphone for sale
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