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OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides

Shenzhen Tecircuit Electronics Limited
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    Buy cheap OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides from wholesalers
     
    Buy cheap OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides from wholesalers
    • Buy cheap OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides from wholesalers
    • Buy cheap OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides from wholesalers
    • Buy cheap OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides from wholesalers

    OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides

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    Brand Name : TECircuit
    Model Number : TEC0005
    Certification : UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
    Price : Negotiable
    Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
    Supply Ability : 50000 pcs/month
    Delivery Time : 5-15 wotk days
    • Product Details
    • Company Profile

    OEM Multilayer Printed Circuit Board RIGID PCB Semi Metalized Trough On Four Sides

    Product Description
    Application:communication
    Layer Count:6
    Material:FR-4
    Thickness:1.2mm
    Min.Hole Size:0.2mm
    Dimension:160*86
    Surface Finish:ENIG
    Special Feature:Semi-metalized trough on four sides
    Product Image

    TECircuit Capability


    1. Schematic development and PCB layout(what we use is Protel, PADS)
    2. PCB fabrication from 1-40 layers. (single side, double side, multi-layer, HDI board, bury and blind holes board etc)
    3. Material procurement and management
    4. Prototype and NPI (new product introduction)
    5. PCBA (SMD Placement include 0402,QFP,QFN,BGA etc )and through hole assembly, in-circuit test and functional testing)
    6. IC pre-programming and Function verification & burning test
    7. Complete Unit assembly (Box building include the plastic, screen, metal enclosure, membrane, coils, wire harness etc.)
    8. Environmental Coating
    9. Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure and pac


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