Home > High Frequency PCB >

High Frequency Multilayer PCB Printed Circuit Board for Wireless Base Station

Product Categories

Multilayer PCB [11]
Industrial Control PCB Assembly [42]
HDI PCB [15]
Consumer Electronics PCB Assembly [87]
Quick Turn PCB Assembly [18]
Rigid Flexible PCB [25]
2 Layer PCB [13]
Communication PCB Assembly [19]
Automotive PCB Assembly [30]
FPC Flexible PCB [12]
High Frequency PCB [9]
Gold Finger PCB [11]
Metal Core PCB [28]
IC Substrate PCB [6]
Ceramic PCB Board [6]

Shenzhen Tecircuit Electronics Limited

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

High Frequency Multilayer PCB Printed Circuit Board for Wireless Base Station

Ask Lasest Price
Brand Name :	TECircuit
Model Number :	TEC0160
Certification :	UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Price :	USD 1.99 ~ USD9.99/pcs
Payment Terms :	L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :	50000 pcs/month
Delivery Time :	5-15 wotk days

Add to Cart

Product Details
Company Profile

High Frequency Multilayer PCB Printed Circuit Board for Wireless Base Station

Product Images

About TECircuit

Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2

Product Applications

Signal Processing Units:
- Used in RF signal processing circuits to amplify, filter, and modulate signals for effective transmission and reception.
Transceivers:
- Employed in transceiver modules that handle both transmission and reception of radio signals, crucial for mobile communication.
Antenna Interfaces:
- Integrated into PCBs that connect antennas with the base station, optimizing signal quality and range.
Power Amplifiers:
- Used in high-frequency power amplifier circuits to boost signal strength for long-range communication.
Baseband Processing:
- Employed in baseband processors that handle digital signal processing, enabling efficient data handling and conversion.
Network Interface Cards:
- Integrated into components that manage data communication between the base station and the network, ensuring high-speed connectivity.
Wireless Communication Modules:
- Used in modules for LTE, 5G, and other wireless technologies, facilitating advanced communication capabilities.
Filter Circuits:
- Employed in filter designs that eliminate unwanted frequencies and improve signal clarity.
Digital Signal Processors (DSPs):
- Integrated into circuits that perform complex calculations on digital signals for improved communication quality.
Control Systems:
- Used in control circuits that monitor and manage the operation of base station components, ensuring reliability and efficiency.

Product Features

Low Loss Material:
- Made from materials with low dielectric loss to minimize signal degradation at high frequencies, ensuring efficient signal transmission.
High Thermal Stability:
- Designed to withstand temperature variations, maintaining performance in demanding environments.
Precision Manufacturing:
- Utilizes advanced manufacturing techniques to achieve tight tolerances and high-quality finishes essential for high-frequency applications.
Impedance Control:
- Designed to maintain controlled impedance levels to prevent signal reflections and ensure consistent performance.
Multi-layer Construction:
- Often constructed as multi-layer PCBs to optimize routing and shielding of high-frequency signals, enhancing performance.
Robust Electrical Performance:
- Supports high-speed data transmission with minimal signal loss, critical for modern communication technologies.
Excellent Thermal Management:
- Designed to dissipate heat effectively, ensuring reliable operation of high-power components.
Customizable Designs:
- Can be tailored to specific application requirements, allowing for unique layouts and configurations.
Durability:
- Built to withstand harsh environmental conditions, ensuring long-term reliability in outdoor deployments.
Regulatory Compliance:
- Designed to meet industry standards for safety and performance, ensuring dependable operation in communication networks.

FAQ

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

Product Description

Specification:
PCB layers:	1-42layers
PCB materials:	CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:	620mm*1100mm
PCB certificate:	RoHS Directive-Compliant
PCB Thickness:	1.6 ±0.1mm
Out Layer Copper Thickness:	0.5-5oz
Inner Layer Copper Thickness:	0.5-4oz
PCB max. board thickness:	6.0mm
Minimum Hole Size:	0.20mm
Minimum Line Width/Space:	3/3mil
Min. S/M Pitch:	0.1mm(4mil)
Plate Thickness and Aperture Ratio :	30:1
Minimum Hole Copper:	20µm
Hole Dia. Tolerance(PTH):	±0.075mm(3mil)
Hole dia. Tolerance(NPTH):	±0.05mm (2mil)
Hole Position Deviation:	±0.05mm (2mil)
Outline Tolerance:	±0.05mm (2mil)
PCB solder mask:	Black, white, yellow
PCB surface finished:	HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend:	White
E-test:	100% AOI, X-ray, Flying probe test.
Outline:	Rout and Score/V-cut
Inspection Standard:	IPC-A-610CCLASSII
Certificates:	UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:	Final Inspection, E-test, Solderability Test, Micro Section and More

Product Tags:


*From:	Your email address is incorrect!
*To:	Shenzhen Tecircuit Electronics Limited
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!