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Metal Core PCB MC PCB Rigid PCB Printed Circuit Board for Smart Phone

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Shenzhen Tecircuit Electronics Limited

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Metal Core PCB MC PCB Rigid PCB Printed Circuit Board for Smart Phone

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Brand Name :	TECircuit
Model Number :	TEC0149
Certification :	UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Price :	USD 1.99 ~ USD9.99/pcs
Payment Terms :	L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :	50000 pcs/month
Delivery Time :	5-15 wotk days

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Product Details
Company Profile

Metal Core PCB MC PCB Rigid PCB Printed Circuit Board for Smart Phone

Product Images

About TECircuit

Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2

Product Applications

Power Management Circuits:
- Used in power supply modules to efficiently manage battery charging and power distribution in smartphones.
RF Modules:
- Employed in radio frequency (RF) components for cellular, Wi-Fi, and Bluetooth communication, ensuring reliable signal quality.
LED Backlighting:
- Integrated into display backlighting systems, providing uniform light distribution and efficient thermal management for screens.
Camera Modules:
- Used in camera systems to manage power delivery and heat dissipation for high-resolution imaging sensors and flash components.
Audio Amplifiers:
- Employed in audio output circuits, enhancing sound quality while managing heat generated by amplifiers.
Charging Ports:
- Integrated into charging and data transfer ports, ensuring robust performance and durability under frequent use.
Vibration Motors:
- Used in haptic feedback systems to manage power and thermal performance, enhancing user interaction.
Sensor Modules:
- Employed in various sensors (e.g., accelerometers, gyroscopes) to ensure stable power delivery and accurate readings.
Wireless Charging Circuits:
- Integrated into wireless charging systems, providing efficient power transfer while managing heat buildup.
Thermal Management Systems:
- Used in designs that require effective heat dissipation to maintain optimal performance and longevity of components.

Product Features

High Thermal Conductivity:
- Metal core PCBs (MCPCBs) provide excellent heat dissipation, crucial for maintaining performance in compact smartphone designs.
Durability:
- The robust aluminum substrate can withstand mechanical stress and environmental conditions typical in smartphone usage.
Low Coefficient of Thermal Expansion (CTE):
- The CTE of metal cores is compatible with that of electronic components, minimizing thermal stress and enhancing reliability.
High Electrical Performance:
- Offers low electrical resistance, ensuring efficient power delivery and reducing energy loss in circuits.
Compact Design:
- Allows for thinner and lighter designs, essential for modern smartphones that prioritize portability and sleek aesthetics.
Improved Signal Integrity:
- Facilitates better performance in RF applications, enhancing communication reliability and range.
Versatile Design Options:
- Can be customized in layout, size, and component arrangement to meet specific smartphone design requirements.
Ease of Manufacturing:
- Compatible with standard PCB manufacturing processes, facilitating efficient production and assembly.
Cost-Effectiveness:
- While generally more expensive than standard FR4 PCBs, the benefits in thermal management and performance often justify the investment.
Regulatory Compliance:
- Designed to meet industry standards for safety and performance, ensuring reliable operation in various smartphone applications.

FAQ

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

Product Description

Specification:
PCB layers:	1-42layers
PCB materials:	CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:	620mm*1100mm
PCB certificate:	RoHS Directive-Compliant
PCB Thickness:	1.6 ±0.1mm
Out Layer Copper Thickness:	0.5-5oz
Inner Layer Copper Thickness:	0.5-4oz
PCB max. board thickness:	6.0mm
Minimum Hole Size:	0.20mm
Minimum Line Width/Space:	3/3mil
Min. S/M Pitch:	0.1mm(4mil)
Plate Thickness and Aperture Ratio :	30:1
Minimum Hole Copper:	20µm
Hole Dia. Tolerance(PTH):	±0.075mm(3mil)
Hole dia. Tolerance(NPTH):	±0.05mm (2mil)
Hole Position Deviation:	±0.05mm (2mil)
Outline Tolerance:	±0.05mm (2mil)
PCB solder mask:	Black, white, yellow
PCB surface finished:	HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend:	White
E-test:	100% AOI, X-ray, Flying probe test.
Outline:	Rout and Score/V-cut
Inspection Standard:	IPC-A-610CCLASSII
Certificates:	UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:	Final Inspection, E-test, Solderability Test, Micro Section and More

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