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Metal Core PCB Copper Substrate Rigid PCB CuPCB Metal Heat Dissi Pation

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Shenzhen Tecircuit Electronics Limited

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Metal Core PCB Copper Substrate Rigid PCB CuPCB Metal Heat Dissi Pation

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Brand Name :	TECircuit
Model Number :	TEC0122
Certification :	UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Price :	USD 1.99 ~ USD9.99/pcs
Payment Terms :	L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :	50000 pcs/month
Delivery Time :	5-15 wotk days

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Product Details
Company Profile

Metal Core PCB Copper Substrate Rigid PCB CuPCB Metal Heat Dissi Pation

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About TECircuit

Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2

Product Applications

Power Electronics:
- Commonly used in power amplifiers, converters, and inverters due to their excellent thermal conductivity, which helps manage heat generated in high-power applications.
LED Lighting:
- Employed in LED lighting systems to dissipate heat efficiently, ensuring optimal performance and longevity of LED components.
RF and Microwave Applications:
- Used in radio frequency (RF) and microwave circuits, where low signal loss and high thermal performance are critical for effective operation.
Automotive Electronics:
- Integrated into automotive control units, sensors, and power management systems, where reliability and thermal management are essential.
Telecommunications Equipment:
- Used in telecom devices to support high-frequency signals, benefiting from copper's conductivity and thermal properties.
Industrial Equipment:
- Employed in industrial control systems and machinery where durability and heat resistance are required.
Consumer Electronics:
- Integrated into high-performance consumer devices such as gaming consoles and high-end audio equipment for superior thermal and electrical performance.
Renewable Energy:
- Used in solar inverters and wind turbine controllers, where efficient heat dissipation is crucial for reliable operation.
Medical Devices:
- Employed in medical equipment that requires precise thermal management, such as imaging systems and diagnostic devices.
Heat Sink Applications:
- Used in PCB designs that act as heat sinks, enhancing thermal management in various electronic applications.

Product Features

Excellent Thermal Conductivity:
- Copper substrates provide superior heat dissipation compared to traditional FR4 materials, making them ideal for high-power applications.
High Electrical Conductivity:
- Offers low resistance and high conductivity, which is essential for minimizing energy losses in power circuits.
Durability:
- Copper substrates are more robust and can withstand higher temperatures and mechanical stresses compared to standard PCBs.
Lightweight:
- Despite their strength, copper substrates can be lightweight, which is beneficial for portable and compact electronic devices.
Good Dimensional Stability:
- Maintains structural integrity under varying thermal conditions, reducing the risk of warping or delamination.
Compatibility with Various Processes:
- Compatible with standard PCB manufacturing processes, including surface mount technology (SMT) and through-hole assembly.
Design Flexibility:
- Allows for intricate designs and layouts due to the malleability of copper, enabling complex circuitry in compact spaces.
Cost Considerations:
- While typically more expensive than standard FR4 PCBs, the long-term benefits of performance and durability often justify the investment.
Environmental Resistance:
- Copper substrates can be treated for enhanced resistance to corrosion and environmental factors, prolonging the lifespan of the PCB.
Thermal Management Solutions:
- Often designed in conjunction with additional thermal management features, such as vias and heat sinks, to optimize heat dissipation in high-performance applications.

FAQ

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

Product Description

Specification:
PCB layers:	1-42layers
PCB materials:	CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:	620mm*1100mm
PCB certificate:	RoHS Directive-Compliant
PCB Thickness:	1.6 ±0.1mm
Out Layer Copper Thickness:	0.5-5oz
Inner Layer Copper Thickness:	0.5-4oz
PCB max. board thickness:	6.0mm
Minimum Hole Size:	0.20mm
Minimum Line Width/Space:	3/3mil
Min. S/M Pitch:	0.1mm(4mil)
Plate Thickness and Aperture Ratio :	30:1
Minimum Hole Copper:	20µm
Hole Dia. Tolerance(PTH):	±0.075mm(3mil)
Hole dia. Tolerance(NPTH):	±0.05mm (2mil)
Hole Position Deviation:	±0.05mm (2mil)
Outline Tolerance:	±0.05mm (2mil)
PCB solder mask:	Black, white, yellow
PCB surface finished:	HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend:	White
E-test:	100% AOI, X-ray, Flying probe test.
Outline:	Rout and Score/V-cut
Inspection Standard:	IPC-A-610CCLASSII
Certificates:	UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:	Final Inspection, E-test, Solderability Test, Micro Section and More

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