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IC Substrate Multilayer PCB , HDI Rigid PCB ENIG Surface for RF Module

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Shenzhen Tecircuit Electronics Limited

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IC Substrate Multilayer PCB , HDI Rigid PCB ENIG Surface for RF Module

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Brand Name :	TECircuit
Model Number :	TEC0203
Certification :	UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Price :	USD 1.99 ~ USD9.99/pcs
Payment Terms :	L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :	50000 pcs/month
Delivery Time :	5-15 wotk days

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Product Details
Company Profile

IC Substrate Multilayer PCB , HDI Rigid PCB ENIG Surface for RF Module

Product Images

About TECircuit

Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2

Product Applications

Wireless Communication Devices:
- Used in smartphones, tablets, and laptops to facilitate high-frequency wireless communication, including Wi-Fi, Bluetooth, and cellular signals.
IoT Devices:
- Employed in Internet of Things (IoT) applications, connecting sensors, actuators, and communication modules for smart home and industrial automation.
RFID Systems:
- Integrated into radio-frequency identification (RFID) systems for tracking and identification in logistics, retail, and access control.
Satellite Communication:
- Used in satellite transceivers for reliable communication in aerospace and defense applications, ensuring high performance in challenging environments.
Telecommunication Infrastructure:
- Employed in base stations and other telecom equipment to manage signal transmission and reception over various frequencies.
Medical Devices:
- Integrated into RF-enabled medical equipment, such as wireless patient monitoring systems and diagnostic tools, enhancing connectivity and data transmission.
Automotive Applications:
- Used in vehicle communication systems, including V2X (vehicle-to-everything) technologies, for improved safety and navigation.
Consumer Electronics:
- Employed in devices like smart TVs and gaming consoles to support wireless streaming and connectivity features.
Wireless Charging Systems:
- Integrated into systems that enable wireless charging for mobile devices and electric vehicles, facilitating convenient power transfer.
Sensors and Actuators:
- Used in RF-based sensors and actuators for remote control applications, enhancing automation and responsiveness.

Product Features

High-Frequency Performance:
- Designed to operate efficiently at high frequencies, ensuring minimal signal loss and distortion during transmission.
Excellent Signal Integrity:
- Engineered to maintain high signal integrity, reducing electromagnetic interference (EMI) and crosstalk in RF applications.
Low Dielectric Loss:
- Materials used are chosen for low dielectric loss, which is crucial for maintaining performance in RF communication.
Thermal Management:
- Effective heat dissipation features to manage thermal performance, ensuring the reliability of RF components during operation.
Compact Design:
- Optimized for small form factors, allowing for integration into compact electronic devices without sacrificing performance.
Customizability:
- Can be tailored to specific RF requirements, including layer counts, material types, and component placements.
Durability:
- Built to withstand environmental stresses, including temperature variations and mechanical vibrations, ensuring long-term reliability.
Compatibility with Various ICs:
- Designed to accommodate various RF ICs and components, facilitating diverse applications in wireless communication.
Resistance to Environmental Factors:
- Often treated to resist moisture, dust, and chemical exposure, enhancing reliability in various operating conditions.
Compliance with Industry Standards:
- Manufactured to meet relevant telecommunications and safety standards, ensuring dependable operation in critical applications.

FAQ

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

Product Description

Specification:
PCB layers:	1-42layers
PCB materials:	CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:	620mm*1100mm
PCB certificate:	RoHS Directive-Compliant
PCB Thickness:	1.6 ±0.1mm
Out Layer Copper Thickness:	0.5-5oz
Inner Layer Copper Thickness:	0.5-4oz
PCB max. board thickness:	6.0mm
Minimum Hole Size:	0.20mm
Minimum Line Width/Space:	3/3mil
Min. S/M Pitch:	0.1mm(4mil)
Plate Thickness and Aperture Ratio :	30:1
Minimum Hole Copper:	20µm
Hole Dia. Tolerance(PTH):	±0.075mm(3mil)
Hole dia. Tolerance(NPTH):	±0.05mm (2mil)
Hole Position Deviation:	±0.05mm (2mil)
Outline Tolerance:	±0.05mm (2mil)
PCB solder mask:	Black, white, yellow
PCB surface finished:	HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend:	White
E-test:	100% AOI, X-ray, Flying probe test.
Outline:	Rout and Score/V-cut
Inspection Standard:	IPC-A-610CCLASSII
Certificates:	UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:	Final Inspection, E-test, Solderability Test, Micro Section and More

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